At the start of the new year, HGTECH successfully collaborated with a renowned domestic leading entity in the X-OUT laser processing field, securing a million-level batch order with its latest carrier board finished product X-out laser mark equipment. This showcases HGTECH's comprehensive strength as a global leading solution provider for the carrier board industry, achieving a strong start in 2024.

Domestic substitution NO.1

HGTECH's remarkable performance

This collaboration with a well-known domestic top client signifies HGTECH's high recognition as a “veteran domestic brand” in the domestic substitution field of IC carrier boards, positioning it as a “pioneer” leading the direction of development.

Due to lagging core technologies, the global high-end carrier board laser equipment market has been long dominated by Korean entities, occupying about 70% of the market share, with domestic offerings unable to compete with imported equipment.

With a comprehensive market layout and profound R&D foundation, HGTECH deeply explores the application scenarios of “laser + intelligent manufacturing” in the IC carrier board industry. Leveraging the industry chain to expand equipment varieties and introducing new technologies in key processes like laser marking, automatic sorting, and vacuum packaging, HGTECH has become the only domestic entity capable of simultaneously developing large board marks, carrier board finished product X-out laser mark equipment, and automated sorting packaging lines.

Intelligent inspection: “Eagle Eye”

Refined and comprehensive solutions

Defect inspection is a crucial step in chip production. As chips become more integrated and smaller in size, identifying minuscule defects becomes increasingly challenging.

In response to diverse market demands, bringing a more precise and efficient laser “smart manufacturing” experience to the carrier board industry, HGTECH focuses on creating a one-stop solution for FC-CSP/BGA, PBGA/CSP carrier board laser + inspection + automation, currently the most integrated, highest mass production, and most efficient design globally. HGTECH truly becomes a global leader in the carrier board processing industry, comprehensively leading the industry.

With robust technological strength, proprietary intellectual property, and exceptional product quality, HGTECH has collaborated with several top-tier domestic carrier board manufacturers. The carrier board finished product X-out laser mark equipment is widely used in processing fields such as communication and memory chips, 5G RF chips, CPU treatments, becoming the preferred choice for enterprises aiming for domestic substitution and cost reduction.

Solutions

Carrier board finished product X-out laser mark equipment

Sample effect display

Automatic efficiency

Dual station high-speed operation, board flipping mechanism enables one-time processing on both sides of the product

Convenient operation

Completes new procedure setup in 20 minutes, allowing for quick transitions

Intelligent identification

Automatically identifies markings from previous processes or directly acquires mapping document information on waste board positions for marking

Stable and secure

Equipped with an energy monitoring system, ensuring consistent and stable product processing effects

In the future, HGTECH will continue to focus on the PCB industry, persist in technological breakthroughs and innovations, providing more professional and comprehensive total solutions for industry clients. The PCB Microelectronics Division is dedicated to becoming the most authoritative solution provider for IC carrier board laser + inspection + automation equipment globally.

Continuously leading domestically

Securing the industry with laser technology

HGTECH

A leading brand in IC carrier board processing